A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction-Reference-Cited by-同舟云学术

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

Published:2022 Issue:6 Volume:9 Page:1690-1699
ISSN:2051-6347
Container-title:Materials Horizons
language:en
Short-container-title:Mater. Horiz.

Author:

Guo Cong¹,Li Yuhan²,Xu JianHua³^ORCID,Zhang Qin¹,Wu Kai¹^ORCID,Fu Qiang¹^ORCID

Affiliation:

1. College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, P. R. China

2. College of Chemistry and Green Catalysis Center, Zhengzhou Key Laboratory of Elastic Sealing Materials, Zhengzhou University, Zhengzhou 450001, China

3. Joint Laboratory of Advanced Biomedical Materials, College of Chemical Engineering, Nanjing Forestry University, Nanjing 210037, P. R. China

Abstract

A ternary polyurethane composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion was synthesized, promising low thermal resistance and durable thermal contact with electronic substrates.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2022/MH/D2MH00276K

Reference58 articles.

1. Emerging challenges and materials for thermal management of electronics

2. The chips are down for Moore’s law