A low temperature and air-sinterable copper–diamine complex-based metal organic decomposition ink for printed electronics
Author:
Affiliation:
1. Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education)
2. Northeastern University
3. Shenyang
4. China
5. Institute of Ceramics and Powder Metallurgy
Abstract
A Cu–diamine formulated ink for obtaining flexible conductive Cu films in an air atmosphere at temperatures as low as 130 °C.
Funder
National Natural Science Foundation of China
China Academy of Engineering Physics
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2018/TC/C8TC01849A
Reference44 articles.
1. Inorganic nanomaterials for printed electronics: a review
2. Printable Functional Chips Based on Nanoparticle Assembly
3. Reactive Silver Inks for Patterning High-Conductivity Features at Mild Temperatures
4. Highly Flexible Silver Nanowire Electrodes for Shape-Memory Polymer Light-Emitting Diodes
5. Flexible Miniaturized Nickel Oxide Thermistor Arrays via Inkjet Printing Technology
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