Plasma treatment effect on polymer buried interfacial structure and property-Reference-Cited by-同舟云学术

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Plasma treatment effect on polymer buried interfacial structure and property

Published:2017 Issue:19 Volume:19 Page:12144-12155
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Ulrich Nathan W.¹²³⁴⁵^ORCID,Andre John¹⁶⁷⁵,Williamson Jaimal⁸⁹¹⁰⁵,Lee Kang-Wook¹¹¹²⁵,Chen Zhan¹²³⁴⁵

Affiliation:

1. Department of Chemistry

2. University of Michigan

3. 930 North University Avenue

4. Ann Arbor

5. USA

6. Humboldt State University

7. Arcata

8. Texas Instruments Incorporated

9. Mail Stop 3621

10. Dallas

11. IBM Thomas J. Watson Research Center

12. Yorktown Heights

Abstract

Adhesion is important in many industrial applications including those in the microelectronics industry.

Funder

Semiconductor Research Corporation

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2017/CP/C7CP00567A

Reference84 articles.

1. Recent advances in hermetic equivalent flip-chip hybrid IC packaging of microelectronics

2. Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

3. Fatigue crack propagation behavior of underfill materials in microelectronic packaging

4. The effects of underfill and its material models on thermomechanical behaviors of a flip chip package

5. STUDY ON PROPERTY OF UNDERFILL BASED ON EPOXY CURED WITH ACID ANHYDRIDE FOR FLIP CHIP APPLICATION

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3. Revealing Interfacial Structures between Silica and Epoxy Adhesive via Spectroscopy and Morphological and Adhesion Tests;The Journal of Physical Chemistry C;2024-02-22

4. Silane Effects on Adhesion Enhancement of 2K Polyurethane Adhesives;Langmuir;2023-12-12

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