Bonding and the role of electrostatics in driving C–C bond formation in high valent organocopper compounds
Author:
Affiliation:
1. Department of Chemistry, Trinity University, San Antonio, Texas 78212-7200, USA
2. Department of Chemistry and Chemical Biology, Baker Laboratory, Cornell University, 162 Sciences Drive, Ithaca, NY 14853, USA
Abstract
Funder
National Institutes of Health
National Science Foundation
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,General Chemistry,Ceramics and Composites,Electronic, Optical and Magnetic Materials,Catalysis
Link
http://pubs.rsc.org/en/content/articlepdf/2023/CC/D2CC05865K
Reference24 articles.
1. Tetrahedron report number 163
2. Mechanisms of Nucleophilic Organocopper(I) Reactions
3. Diamine ligands in copper-catalyzed reactions
4. The role of organometallic copper(iii) complexes in homogeneous catalysis
5. Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes
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