A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis
Author:
Affiliation:
1. Institute of Intelligent Machines
2. Chinese Academy of Sciences
3. Hefei
4. PR China
5. University of Science and Technology of China
Abstract
A low-cost hybrid bonding of integrated PMMA and a PCB with successful application of ion detection by ME-C4D is proposed.
Funder
“Strategic Priority Research Program” of the Chinese Academy of Sciences
Publisher
Royal Society of Chemistry (RSC)
Subject
General Engineering,General Chemical Engineering,Analytical Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2019/AY/C8AY02642D
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