PVA–FeCl<sub>3</sub> composites as substrate and packaging materials for the controlled degradation of non-degradable metals in transient electronics-Reference-Cited by-同舟云学术

PVA–FeCl₃ composites as substrate and packaging materials for the controlled degradation of non-degradable metals in transient electronics

Published:2023 Issue:24 Volume:11 Page:12999-13006
ISSN:2050-7488
Container-title:Journal of Materials Chemistry A
language:en
Short-container-title:J. Mater. Chem. A

Author:

Mittal Neeru¹^ORCID,Jang Tae-Min²^ORCID,Hwang Suk-Won²³⁴^ORCID,Niederberger Markus¹^ORCID

Affiliation:

1. Laboratory for Multifunctional Materials, Department of Materials, ETH Zürich, Vladimir-Prelog-Weg 5, 8093 Zurich, Switzerland

2. KU-KIST Graduate School of Converging Science & Technology, Korea University, Seoul, 02841, South Korea

3. Department of Integrative Energy Engineering, Korea University, Seoul, 02841, South Korea

4. Center for Biomaterials, Biomedical Research Institute, Korea Institute of Science and Technology (KIST), Seoul, 02792, South Korea

Abstract

We present a PVA–FeCl3 composite as a substrate and packaging material that can initiate the controlled dissolution of non-transient metals such as Al and Cu in water.

Funder

Eidgenössische Technische Hochschule Zürich

National Research Foundation of Korea

Ministry of Science and ICT, South Korea

KU-KIST Graduate School of Converging Science and Technology

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/TA/D2TA09507F

Reference40 articles.

1. A Physically Transient Form of Silicon Electronics

2. Transient Electronics: Materials and Devices

3. Multifunctional Batteries: Flexible, Transient, and Transparent

4. Dissolvable Metals for Transient Electronics

5. Dissolution Behaviors and Applications of Silicon Oxides and Nitrides in Transient Electronics

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