Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology-Reference-Cited by-同舟云学术

Ultralow flexural properties of copper microhelices fabricated via electrodeposition-based three-dimensional direct-writing technology

Published:2017 Issue:34 Volume:9 Page:12524-12532
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Yi Zhiran¹²³⁴⁵,Lei Yu¹²³⁴⁵,Zhang Xianyun¹²³⁴⁵^ORCID,Chen Yining⁶⁷⁸⁹,Guo Jianjun¹²³⁴⁵^ORCID,Xu Gaojie¹²³⁴⁵,Yu Min-Feng⁶⁷⁸⁹,Cui Ping¹²³⁴⁵

Affiliation:

1. Zhejiang Key Laboratory of Additive Manufacturing Materials

2. Ningbo Institute of Materials Technology and Engineering

3. Chinese Academy of Sciences

4. Ningbo 315201

5. China

6. D. Guggenheim School of Aerospace Engineering

7. Georgia Institute of Technology

8. Atlanta

9. USA

Abstract

The ultralow stiffness of copper microhelices fabricated by a MCED direct-writing method was studied by the electrically induced quasi-static and dynamic electromechanical resonance technique.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2017/NR/C7NR03803H

Reference67 articles.

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2. Superelasticity and Nanofracture Mechanics of ZnO Nanohelices

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4. Torsion-induced effects in magnetic nanowires

5. Piezoresistive InGaAs/GaAs Nanosprings with Metal Connectors

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