Chip-based <i>in situ</i> TEM investigation of structural thermal instability in aged layered cathode-Reference-Cited by-同舟云学术

Chip-based in situ TEM investigation of structural thermal instability in aged layered cathode

Published:2023 Issue:16 Volume:5 Page:4182-4190
ISSN:2516-0230
Container-title:Nanoscale Advances
language:en
Short-container-title:Nanoscale Adv.

Author:

Wang Yuhan¹,Yuan Yuan²,Liao Xiaobin¹^ORCID,Van Tendeloo Gustaaf³⁴,Zhao Yan¹^ORCID,Sun Congli¹³^ORCID

Affiliation:

1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, International School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China

2. Hongqi Integrated Circuit (Zhuhai) Co., Ltd, China

3. NRC (Nanostructure Research Centre), Wuhan University of Technology, Wuhan 430070, China

4. EMAT (Electron Microscopy for Materials Science), University of Antwerp, Belgium

Abstract

Thermally induced oxygen release is an intrinsic structural instability in layered cathodes, which causes thermal runaway issues and becomes increasingly critical with the continuous improvement in energy density.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Royal Society of Chemistry (RSC)

Subject

General Engineering,General Materials Science,General Chemistry,Atomic and Molecular Physics, and Optics,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2023/NA/D3NA00201B

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