Enhancement of pressure-free bonding with Cu particles by the addition of Cu–Ni alloy nanoparticles
Author:
Publisher
Royal Society of Chemistry (RSC)
Subject
Materials Chemistry,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2014/TC/C4TC00240G
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1. A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
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5. Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles
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