Electrochemistry and speciation of Au+ in a deep eutectic solvent: growth and morphology of galvanic immersion coatings-Reference-Cited by-同舟云学术

Electrochemistry and speciation of Au+ in a deep eutectic solvent: growth and morphology of galvanic immersion coatings

Published:2015 Issue:45 Volume:17 Page:30540-30550
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Ballantyne Andrew D.¹²³⁴⁵^ORCID,Forrest Gregory C. H.¹²³⁴⁵,Frisch Gero⁶⁷⁸⁹,Hartley Jennifer M.⁶⁷⁸⁹,Ryder Karl S.¹²³⁴⁵

Affiliation:

1. Materials Centre

2. Department of Chemistry

3. University of Leicester

4. Leicester LE1 7RH

5. UK

6. Institut für Anorganische Chemie

7. TU Bergakademie Freiberg

8. 09599 Freiberg

9. Germany

Abstract

In this study we compare the electrochemical and structural properties of three gold salts AuCl, AuCN and KAu(CN)₂ in a Deep Eutectic Solvent (DES) electrolyte (Ethaline 200) in order to elucidate factors affecting the galvanic deposition of gold coatings on nickel substrates.

Funder

Seventh Framework Programme

Deutsche Forschungsgemeinschaft

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2015/CP/C5CP05748E

Reference49 articles.

1. Some recent developments in non-cyanide gold plating for electronics applications

2. M. Schlesinger and M.Paunovic, Modern Electroplating, Wiley, 2011