Hydrogen solubility and diffusivity at Σ3 grain boundary of PdCu-Reference-Cited by-同舟云学术

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Hydrogen solubility and diffusivity at Σ3 grain boundary of PdCu

Published:2021 Issue:22 Volume:11 Page:13644-13652
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Liu L. C.¹²³⁴⁵,Gong H. R.¹²³⁴^ORCID

Affiliation:

1. State Key Laboratory of Powder Metallurgy

2. Central South University

3. Changsha

4. China

5. College of Physics and Electronics

Abstract

The atom structure of BCC PdCu Σ3 (112) GB, and hydrogen diffusion through BCC PdCu Σ3 (112) GB.

Funder

Fundamental Research Funds for Central Universities of the Central South University

State Key Laboratory of Powder Metallurgy

Central South University

Natural Science Foundation of Hunan Province

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2021/RA/D0RA10133H

Reference60 articles.

1. SIMS study of hydrogen at the surface and grain boundaries of nickel bicrystals

2. Hydrogen induced grain boundary fracture in high purity nickel and its alloys—Enhanced hydrogen diffusion along grain boundaries

3. Grain boundary diffusion of hydrogen in nickel

4. Intercrystalline hydrogen transport in nanocrystalline nickel

5. Grain boundary transport of hydrogen in nickel

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1. Unveiling the roles of initial phase constituents and phase metastability in hydrogen embrittlement of TRIP‐assisted VCrCoFeNi medium‐entropy alloys;Journal of Materials Science & Technology;2025-02

2. Hydrogen transport through Mo2C/PdCu composite membranes;Applied Surface Science;2024-09

3. In situ visualization of misorientation-dependent hydrogen diffusion at grain boundaries of pure polycrystalline Ni using a hydrogen video imaging system;Acta Materialia;2024-01

4. Fundamental properties of hydrogen at PdCu–Mo2C interfaces from first principles calculations;International Journal of Hydrogen Energy;2023-10

5. Cohesion properties and hydrogen permeation at PdCu/TiAl interface;Surface Science;2023-01

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