Spatially modulated stiffness on hydrogels for soft and stretchable integrated electronics-Reference-Cited by-同舟云学术

Spatially modulated stiffness on hydrogels for soft and stretchable integrated electronics

Published:2020 Issue:1 Volume:7 Page:203-213
ISSN:2051-6347
Container-title:Materials Horizons
language:en
Short-container-title:Mater. Horiz.

Author:

Liu Hao¹²³⁴⁵,Li Moxiao⁶³⁴⁵⁷,Liu Shaobao¹²³⁴⁵,Jia Pengpeng¹²³⁴⁵,Guo Xiaojin⁶³⁴⁵⁸,Feng Shangsheng¹²³⁴⁵,Lu Tian Jian⁹¹⁰¹¹⁵,Yang Huayuan¹²¹³¹⁴⁵,Li Fei¹²³⁴⁵^ORCID,Xu Feng¹²³⁴⁵^ORCID

Affiliation:

1. The Key Laboratory of Biomedical Information Engineering of Ministry of Education

2. School of Life Science and Technology

3. Xi’an Jiaotong University

4. Xi’an 710049

5. P. R. China

6. Bioinspired Engineering and Biomechanics Center (BEBC)

7. State Key Laboratory for Strength and Vibration of Mechanical Structures

8. School of Science

9. State Key Laboratory of Mechanics and Control of Mechanical Structures

10. Nanjing University of Aeronautics and Astronautics

11. Nanjing 210016

12. Department of Traditional Chinese Medicine Engineering

13. Shanghai University of Traditional Chinese Medicine

14. Shanghai 201203

Abstract

A versatile method for spatially modulating hydrogel stiffness was proposed. The locally stiffened hydrogel presented tunable strain-shielding ability and thus aided to electronic components integration for wearable electronics.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

National Basic Research Program of China

Fundamental Research Funds for the Central Universities

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2020/MH/C9MH01211G

Reference41 articles.