Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications

Author:

Sahay Rahul12ORCID,Tu Yen-Cheng3,Aziz Izzat4ORCID,Budiman Arief S.1567ORCID,Tan Cher Ming38ORCID,Lee Pooi See4ORCID,Thomas Olivier2ORCID,Raghavan Nagarajan9ORCID

Affiliation:

1. Xtreme Materials Lab, Engineering Product Development (EPD) Pillar, Singapore University of Technology and Design (SUTD), 487372, Singapore

2. Aix-Marseille Univ., CNRS, Univ. de Toulon, IM2NP UMR 7334, 13397 Marseille, France

3. Center for Reliability Sciences and Technologies (CReST), Department of Electronic Engineering, Chang Gung University, Taiwan

4. School of Materials Science and Engineering, Nanyang Technological University, 639798, Singapore

5. Department of Manufacturing and Mechanical Engineering and Technology, Oregon Institute of Technology, Klamath Falls, OR 97601, USA

6. Industrial Engineering Department, BINUS Graduate Program-Master of Industrial Engineering, Bina Nusantara University, Jakarta 11480, Indonesia

7. Oregon Renewable Energy Center (OREC), Klamath Falls, OR 97601, USA

8. Department of Radiation Oncology, Chang Gung Memorial Hospital, Taoyuan 333, Taiwan

9. Nano-Micro Reliability Lab (MRL), Engineering Product Development (EPD) Pillar, Singapore University of Technology and Design (SUTD), 487372, Singapore

Abstract

Novel fracture/fatigue resistant nickel–niobium oxide (crystalline–amorphous) sandwich nanolayers on a polyimide (PI) substrate as a potential candidate for electrodes or interconnects for flexible electronic or energy devices.

Funder

National Research Foundation Singapore

Agence Nationale de la Recherche

Singapore University of Technology and Design

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science,Chemistry (miscellaneous)

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