Enhancing P3HT/PCBM blend stability by thermal crosslinking using poly(3-hexylthiophene)-S,S-dioxide-Reference-Cited by-同舟云学术

Enhancing P3HT/PCBM blend stability by thermal crosslinking using poly(3-hexylthiophene)-S,S-dioxide

Published:2020 Issue:23 Volume:8 Page:7698-7707
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Milanovich M.¹²³⁴⁵,Sarkar T.⁶⁷⁸⁹,Popowski Y.¹²³⁴⁵,Low J. Z.¹⁰¹¹¹²¹³^ORCID,Campos L. M.¹⁰¹¹¹²¹³,Kenig S.¹²³⁴⁵,Frey G. L.⁶⁷⁸⁹^ORCID,Amir E.¹²³⁴⁵^ORCID

Affiliation:

1. Shenkar College of Engineering

2. Design and Art

3. Faculty of Engineering and Design

4. Department of Polymers and Plastics Engineering

5. Ramat Gan 5252626

6. Department of Materials Science & Engineering

7. Technion – Israel Institute of Technology

8. Haifa

9. Israel

10. Department of Chemistry

11. Columbia University

12. New York

13. USA

Abstract

A statistical copolymer containing thiophene and thiophene-S,S-dioxide rings was utilized as a thermal crosslinker in a blend of P3HT and PCBM, demonstrating an effective strategy for preventing agglomeration of PCBM and enhancing blend stability.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2020/TC/D0TC00109K

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