The effect of phonon modes on the H2(v, j)/D2(v, j)–Cu(1nn) scattering processes
Author:
Publisher
Royal Society of Chemistry (RSC)
Subject
Physical and Theoretical Chemistry,General Physics and Astronomy
Link
http://pubs.rsc.org/en/content/articlepdf/2011/CP/C0CP00336K
Reference68 articles.
1. Angular distributions of H2 desorbed from the (100), (110), and (111) faces of copper crystals
2. Adsorption and desorption kinetics in the systems H2/Cu(111), H2/Cu(110) and H2/Cu(100)
3. State-to-state scattering in a reactive system: H2(v=1,J=1) from Cu(100)
4. Scattering of H2 (v=1, J=1) from Cu(110): Survival probability versus incident energy
5. Survival Probability ofH2(v=1,J=1)Scattered from Cu(110)
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. On the quantum dynamical treatment of surface vibrational modes for reactive scattering of H2 from Cu(111) at 925 K;The Journal of Chemical Physics;2024-07-02
2. Effect of surface temperature on quantum dynamics of D2 on Cu(111) using a chemically accurate potential energy surface;The Journal of Chemical Physics;2022-11-21
3. Formulation of temperature dependent effective Hartree potential incorporating quadratic over linear molecular DOFs-surface modes couplings and its effect on quantum dynamics of D2 (v = 0, j = 0)/D2 (v = 0, j = 2) on Cu(111) metal surface;Chemical Physics;2022-01
4. Effect of surface temperature on quantum dynamics of H2 on Cu(111) using a chemically accurate potential energy surface;The Journal of Chemical Physics;2021-03-14
5. H2 Dissociation on H-Precovered Ni(100) Surface: Physisorbed State and Coverage Dependence;The Journal of Physical Chemistry C;2019-02-13
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3