A composite additive used for a new cyanide-free silver plating bath (II): an insight by electrochemical measurements and quantum chemical calculation-Reference-Cited by-同舟云学术

A composite additive used for a new cyanide-free silver plating bath (II): an insight by electrochemical measurements and quantum chemical calculation

Published:2017 Issue:19 Volume:41 Page:11104-11112
ISSN:1144-0546
Container-title:New Journal of Chemistry
language:en
Short-container-title:New J. Chem.

Author:

Liu Anmin¹²³⁴^ORCID,Ren Xuefeng⁵²³⁴,An Maozhong⁶⁷⁸⁹⁴

Affiliation:

1. School of Petroleum and Chemical Engineering

2. Dalian University of Technology

3. Panjin

4. China

5. School of Food and Environment

6. State Key Laboratory of Urban Water Resource and Environment

7. School of Chemistry and Chemical Engineering

8. Harbin Institute of Technology

9. Harbin

Abstract

BPY and PAT are effective additives for silver plating due to their ability for strong adsorption on silver surfaces.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry,Catalysis

Link

http://pubs.rsc.org/en/content/articlepdf/2017/NJ/C7NJ02638B

Reference62 articles.

1. Highly corrosion resistant bright silver metallization deposited from a neutral cyanide-free solution

2. Electroless Silver and Silver with Tungsten Thin Films for Microelectronics and Microelectromechanical System Applications

3. Strong fluorescence emission localized at a tapered silver-plated sub-wavelength pore

4. Electroplating of Cu(Ag) thin films for interconnect applications

5. Silver plating

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