Printing conformal and flexible copper networks for multimodal pressure and flow sensing-Reference-Cited by-同舟云学术

Printing conformal and flexible copper networks for multimodal pressure and flow sensing

Published:2023 Issue:46 Volume:15 Page:18660-18666
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Khuje Saurabh¹^ORCID,Islam Abdullah¹,Yu Jian²,Ren Shenqiang¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering, University of Maryland, College Park, Maryland, 20742, USA

2. DEVCOM Army Research Laboratory, Aberdeen Proving Ground, Maryland 21005, USA

Abstract

A self-powered, flexible multimodal sensor, capable of monitoring temperature, pressure and flow in real time is presented via additive manufacturing of copper inks. The sensor offers superior performance, with applications in wearable electronics.

Funder

DEVCOM Army Research Laboratory

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2023/NR/D3NR03481J

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