Hydrogen bond-modulated molecular packing and its applications in high-performance non-doped organic electroluminescence-Reference-Cited by-同舟云学术

Hydrogen bond-modulated molecular packing and its applications in high-performance non-doped organic electroluminescence

Published:2020 Issue:10 Volume:7 Page:2734-2740
ISSN:2051-6347
Container-title:Materials Horizons
language:en
Short-container-title:Mater. Horiz.

Author:

Shi Yizhong¹²³⁴^ORCID,Wang Kai¹²³⁴⁵^ORCID,Tsuchiya Youichi⁵⁶⁷⁸⁹^ORCID,Liu Wei¹²³⁴⁵,Komino Takeshi⁵⁶⁷⁸,Fan Xiaochun¹²³⁴,Sun Dianming¹²³⁴,Dai Gaole¹²³⁴^ORCID,Chen Jiaxiong¹²³⁴¹⁰^ORCID,Zhang Ming¹¹¹²¹³⁴,Zheng Caijun¹¹¹²¹³⁴^ORCID,Xiong Shiyun¹²³⁴,Ou Xuemei¹²³⁴,Yu Jia¹²³⁴,Jie Jiansheng¹²³⁴^ORCID,Lee Chun-Sing¹⁰¹⁴¹⁵⁴^ORCID,Adachi Chihaya⁵⁶⁷⁸⁹^ORCID,Zhang Xiaohong¹²³⁴^ORCID

Affiliation:

1. Institute of Functional Nano & Soft Materials (FUNSOM) and Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices

2. Soochow University

3. Suzhou

4. P. R. China

5. Center for Organic Photonics and Electronics Research (OPERA) and Department of Applied Chemistry

6. Kyushu University

7. Fukuoka 819-0395

8. Japan

9. JST

10. Center of Super-Diamond and Advanced Films (COSDAF) and Department of Chemistry

11. School of Optoelectronic Information

12. University of Electronic Science and Technology of China (UESTC)

13. Chengdu

14. City University of Hong Kong

15. Hong Kong

Abstract

Suitable intermolecular hydrogen bonding enables the formation of a fixed 3D supramolecular framework and suppresses the exciton nonradiative decays and quenching.

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

National Basic Research Program of China

Collaborative Innovation Center of Suzhou Nano Science and Technology

Priority Academic Program Development of Jiangsu Higher Education Institutions

Higher Education Discipline Innovation Project

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

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