Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C-Reference-Cited by-同舟云学术

Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C

Published:2018 Issue:11 Volume:10 Page:5254-5263
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Li Wanli¹²³⁴⁵^ORCID,Li Cai-Fu⁶³⁷⁵,Lang Fengpei⁶³⁷⁵⁸,Jiu Jinting⁶³⁷⁵⁹,Ueshima Minoru⁹¹⁰¹¹⁵,Wang Hao⁶³⁷⁵⁸,Liu Zhi-Quan⁶³⁷⁵¹²,Suganuma Katsuaki⁶³⁷⁵

Affiliation:

1. Department of Adaptive Machine Systems

2. Graduate School of Engineering

3. Osaka University

4. Osaka

5. Japan

6. The Institute of Scientific and Industrial Research (ISIR)

7. Ibaraki

8. The College of Materials Science and Engineering

9. Senju Metal Industry Co.

10. Ltd

11. Adachi-ku Tokyo

12. Shenyang National Laboratory for Materials Science

Abstract

Self-catalyzed Cu–Ag inks are developed to create highly conductive and stable tracks on heat-sensitive substrates at temperatures below 100 °C.

Funder

China Scholarship Council

Advanced Low Carbon Technology Research and Development Program

Osaka University

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2018/NR/C7NR09225C

Reference53 articles.

1. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

2. Flexible active-matrix electronic ink display

3. High-Resolution Printing of 3D Structures Using an Electrohydrodynamic Inkjet with Multiple Functional Inks

4. Recent Progress in the Development of Printed Thin-Film Transistors and Circuits with High-Resolution Printing Technology

5. Rapid production of large-area, transparent and stretchable electrodes using metal nanofibers as wirelessly operated wearable heaters

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Printing of passive RFID tag antennas on flexible substrates for long read distance applications: Materials and techniques;Journal of Science: Advanced Materials and Devices;2024-12

2. Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices;ACS Applied Electronic Materials;2024-02-28

3. Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks;Applied Surface Science;2024-02

4. Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics;ACS Applied Materials & Interfaces;2022-02-01

5. Cost-Effective and Self-Reducible Cu-Ni Composite Ink for Low Temperature Fabricating Highly Conductive and Anti-Oxidative Electrode;SSRN Electronic Journal;2022