The aggression behavior study of Cl− on the defect structure of passive films on copper-Reference-Cited by-同舟云学术

The aggression behavior study of Cl− on the defect structure of passive films on copper

Published:2019 Issue:28 Volume:9 Page:15772-15779
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Xu Aoni¹²³⁴⁵^ORCID,Dong Chaofang¹²³⁴⁵,Wei Xin¹²³⁴⁵,Li Xiaogang¹²³⁴⁵,Macdonald Digby D.⁶⁷⁸⁹

Affiliation:

1. Corrosion and Protection Center

2. Key Laboratory for Corrosion and Protection (MOE)

3. University of Science and Technology Beijing

4. Beijing 100083

5. China

6. Department of Material Science and Engineering

7. The University of California at Berkeley

8. Berkeley

9. USA

Abstract

The destructive role of chloride ions on the defect structure of barrier layers (bl) is vitally important for understanding the initial breakdown of passive films on metals.

Funder

National Natural Science Foundation of China

National Basic Research Program of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2019/RA/C9RA03402A

Reference36 articles.

1. Kinetics and Mechanisms of Cu Electrodissolution in Chloride Media

2. High‐Rate Copper Dissolution in Hydrochloric Acid Solution

3. A study of the inhibition of iron corrosion in HCl solutions by some amino acids

4. The pitting corrosion of copper

5. Electrochemical corrosion of unalloyed copper in chloride media––a critical review

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