Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review-Reference-Cited by-同舟云学术

Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review

Published:2017 Issue:10 Volume:17 Page:1689-1704
ISSN:1473-0197
Container-title:Lab on a Chip
language:en
Short-container-title:Lab Chip

Author:

Ma Yinji¹²³⁴⁵,Feng Xue¹²³⁴⁵,Rogers John A.⁶⁷⁸⁹¹⁰,Huang Yonggang¹¹¹²¹³¹⁴¹⁵,Zhang Yihui¹²³⁴⁵^ORCID

Affiliation:

1. Department of Engineering Mechanics

2. Center for Mechanics and Materials

3. AML

4. Tsinghua University

5. Beijing

6. Departments of Materials Science and Engineering

7. Biomedical Engineering

8. Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science

9. Center for Bio-Integrated Electronics

10. Simpson Querrey Institute for Nano/Biotechnology

11. Departments of Civil and Environmental Engineering

12. Mechanical Engineering, and Materials Science and Engineering

13. Northwestern University

14. Evanston

15. USA

Abstract

This review highlights five representative material/structure strategies to achieve ‘J-shaped’ stress–strain responses and introduces their applications in stretchable electronics.

Funder

National Science Foundation

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2017/LC/C7LC00289K

Reference142 articles.

1. Ferromagnetic, Folded Electrode Composite as a Soft Interface to the Skin for Long‐Term Electrophysiological Recording

2. Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis

3. Liquid alloy printing of microfluidic stretchable electronics

4. Microfluidic electronics

5. Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes

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