3D printing of highly conductive silver architectures enabled to sinter at low temperatures
Author:
Affiliation:
1. Smart 3D printing TFT
2. Nano Hybrid Technology Research Center
3. Korea Electrotechnology Research Institute (KERI)
4. Changwon-si
5. Republic of Korea
Abstract
Highly conductive 3D Ag architectures are realized by extrusion-based 3D printing using Ag inks enabled to sinter at low temperatures.
Funder
Korea Electrotechnology Research Institute
National Research Foundation of Korea
Publisher
Royal Society of Chemistry (RSC)
Subject
General Materials Science
Link
http://pubs.rsc.org/en/content/articlepdf/2019/NR/C9NR05894J
Reference44 articles.
1. Multiprocess 3D printing for increasing component functionality
2. Three-dimensional printed electronics
3. 3D Printed Quantum Dot Light-Emitting Diodes
4. Three-Dimensional Printable High-Temperature and High-Rate Heaters
5. Graphene Oxide-Based Electrode Inks for 3D-Printed Lithium-Ion Batteries
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