Thermal stress-assisted formation of submicron pillars from a thin film of CoCrCuFeNi high entropy alloy: experiments and simulations-Reference-Cited by-同舟云学术

Thermal stress-assisted formation of submicron pillars from a thin film of CoCrCuFeNi high entropy alloy: experiments and simulations

Published:2023 Issue:41 Volume:13 Page:28513-28526
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Yoon Sungmin¹^ORCID,Kimura Yasuhiro¹,Gu Shaojie¹,Toku Yuhki¹,Ju Yang¹,Cui Yi²^ORCID

Affiliation:

1. Department of Micro-Nano Mechanical Science and Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan

2. Department of Mechanical Systems Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya city, Aichi, 464-8603, Japan

Abstract

For the first time, the thermal stress-assisted formation of submicron pillars (SPs) from a high entropy alloy (HEA) thin film is made possible, and novel molecular dynamics (MD) simulations are proposed to assess the underlying mechanisms.

Funder

Japan Society for the Promotion of Science

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/RA/D3RA04759H

Reference48 articles.

1. Nanostructured High-Entropy Alloys with Multiple Principal Elements: Novel Alloy Design Concepts and Outcomes

2. High-Entropy Alloys: A Critical Review

3. Microstructures and properties of high-entropy alloy films and coatings: a review

4. A fracture-resistant high-entropy alloy for cryogenic applications

5. Enhancing radiation tolerance by controlling defect mobility and migration pathways in multicomponent single-phase alloys

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