Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization-Reference-Cited by-同舟云学术

Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization

Published:2015 Issue:27 Volume:3 Page:7195-7202
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Zha Jun-Wei¹²³⁴⁵,Zhu Tian-Xing¹²³⁴⁵,Wu Yun-Hui¹²³⁴⁵,Wang Si-Jiao¹²³⁴⁵,Li Robert K. Y.⁶⁷⁸⁵,Dang Zhi-Min¹²³⁴⁵

Affiliation:

1. Laboratory of Dielectric Polymer Materials and Devices

2. Department of Polymer Science and Engineering

3. University of Science and Technology Beijing

4. Beijing 100083

5. People's Republic of China

6. Department of Physics and Materials Science

7. City University of Hong Kong

8. Hong Kong

Abstract

Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/TC/C5TC01552A

Reference26 articles.

1. Applications of multi-walled carbon nanotube in electronic packaging

2. ZrO2/epoxy nanocomposite for LED encapsulation

3. Review on Metal-Filled Plastics. Part1. Electrical Conductivity

4. Review on Metal-Filled Plastics. Part 2. Thermal Properties

5. Thermally conductive and electrically insulative nanocomposites based on hyperbranched epoxy and nano-Al2 O3 particles modified epoxy resin

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