Surface engineering of high-<i>k</i> polymeric dielectric layers with a fluorinated organic crosslinker for use in flexible-platform electronics-Reference-Cited by-同舟云学术

Surface engineering of high-k polymeric dielectric layers with a fluorinated organic crosslinker for use in flexible-platform electronics

Published:2024 Issue:16 Volume:6 Page:4119-4127
ISSN:2516-0230
Container-title:Nanoscale Advances
language:en
Short-container-title:Nanoscale Adv.

Author:

Ye Heqing¹²,Kwon Hyeok-jin³,Ryu Ka Yeon⁴,Wu Kaibin²^ORCID,Park Jeongwan⁴,Babita Giri⁴,Kim Inae⁵,Yang Chanwoo⁵^ORCID,Kong Hoyoul⁴,Kim Se Hyun²^ORCID

Affiliation:

1. School of Flexible Electronics (SoFE), Henan Institute of Flexible Electronics (HIFE), Henan University, 379 Mingli Road, Zhengzhou 450046, China

2. School of Chemical Engineering, Konkuk University, Seoul 05029, Korea

3. Department of Industrial Chemistry, Pukyong National University, Busan 48513, Republic of Korea

4. Department of Chemistry, Research Institute of Nature Science, Gyeongsang National University, Jinju 52828, Republic of Korea

5. Advanced Nano-Surface & Wearable Electronics Research Laboratory, Heat and Surface Technology R&D Department, Korea Institute of Industrial Technology, Incheon 21999, Korea

Abstract

High-k polymeric layers with UV-assisted organic azide fluorine-based crosslinkers lead to dramatic improvements in the electrical performance of OFETs and integrated devices.

Funder

National Research Foundation of Korea

Ministry of Science and ICT, South Korea

Ministry of Trade, Industry and Energy

Pukyong National University

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NA/D3NA01018J

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