Thermoelectric nanowires for dense 3D printed architectures

Author:

Zhang Danwei1ORCID,Ramiah Jayanthi12,Cagirici Mehmet3ORCID,Saglik Kivanc14,Solco Samantha Faye Duran1,Cao Jing1ORCID,Xu Jianwei15ORCID,Suwardi Ady16ORCID

Affiliation:

1. Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), Singapore, 138634

2. School of Chemistry, The University of Sydney, Camperdown, NSW 2050, Australia

3. Singapore Centre for 3D Printing, Nanyang Technological University, 65 Nanyang Drive, Singapore, 639798

4. School of Materials Science and Engineering, College of Engineering, Nanyang Technological University, Singapore, 639798

5. Institute of Sustainability for Chemicals, Energy and Environment, Agency for Science, Technology and Research (A*STAR), Singapore, 627833

6. Department of Materials Science and Engineering, College of Design and Engineering, National University of Singapore, Singapore, 117575

Abstract

The density of pressure-less sintered 3D-printed thermoelectrics is improved through a binder-less and sintering aid-free nanowire ink system. The effectiveness of densification is quantified by a dimensionless metric – filler-derived density (FDI) index.

Funder

Agency for Science, Technology and Research

Publisher

Royal Society of Chemistry (RSC)

Subject

Electrical and Electronic Engineering,Process Chemistry and Technology,Mechanics of Materials,General Materials Science

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