Thermal transport across copper–water interfaces according to deep potential molecular dynamics-Reference-Cited by-同舟云学术

Thermal transport across copper–water interfaces according to deep potential molecular dynamics

Published:2023 Issue:9 Volume:25 Page:6746-6756
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Li Zhiqiang¹^ORCID,Tan Xiaoyu²,Fu Zhiwei²³,Liu Linhua¹²^ORCID,Yang Jia-Yue¹²^ORCID

Affiliation:

1. Optics & Thermal Radiation Research Center, Institute of Frontier and Interdisciplinary Science, Shandong University, Qingdao, Shandong 266237, China

2. School of Energy and Power Engineering, Shandong University, Jinan, Shandong 250061, China

3. Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The 5th Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou 511370, China

Abstract

A deep learning potential distinct from the empirical potential is developed for the study of thermal transport across solid–liquid interfaces.

Funder

National Natural Science Foundation of China

Shandong University

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2023/CP/D2CP05530A

Reference58 articles.