Direct glass-to-glass bonding obtained <i>via</i> simplified ammonia-based low-temperature procedure resists high shear stress and powerful CW fiber laser irradiation-Reference-Cited by-同舟云学术

Direct glass-to-glass bonding obtained via simplified ammonia-based low-temperature procedure resists high shear stress and powerful CW fiber laser irradiation

Published:2022 Issue:48 Volume:12 Page:31016-31023
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Zhou Jansen¹^ORCID,Mei Nanqin²³^ORCID,Leonenko Zoya²³⁴,Zhou Norman¹^ORCID,Mayer Michael¹^ORCID

Affiliation:

1. Centre for Advanced Materials Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Ave W, Waterloo, ON, N2L 3G1, Canada

2. Department of Physics and Astronomy, University of Waterloo, 200 University Ave W, Waterloo, ON, N2L 3G1, Canada

3. Waterloo Institute for Nanotechnology, University of Waterloo, 200 University Ave W, Waterloo, ON, N2L 3G1, Canada

4. Department of Biology, University of Waterloo, 200 University Ave W, Waterloo, ON, N2L 3G1, Canada

Abstract

Strong bonds (≈7.81 MPa on average) were achieved using unidirectional pressure of approximately 0.88 MPa applied by the shown apparatus and bonding temperatures between 160 °C and 300 °C applied for 30 min in air.

Funder

Natural Sciences and Engineering Research Council of Canada

Waterloo Institute for Nanotechnology, University of Waterloo

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/RA/D2RA04234G

Reference33 articles.

1. Development of novel low temperature bonding technologies for microchip chemical analysis applications

2. Effects of static load and residual stress on fused silica direct bonding interface properties