A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al2O3 clusters
Author:
Affiliation:
1. School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, 230009, People's Republic of China
Abstract
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2022/RA/D1RA09417C
Reference37 articles.
1. Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials
2. High-Performance Light-Emitting Diodes Encapsulated with Silica-Filled Epoxy Materials
3. Preparation of low-CTE composite using new alkoxysilyl-functionalized bisphenol A novolac epoxy and its CTE enhancement mechanism
4. Tuning Epoxy Thermomechanics via Thermal Isomerization: A Route to Negative Coefficient of Thermal Expansion Materials
5. Study on Preparation and Properties of Polyurethane-Based AlN Potting Compounds
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