Parametric study on conductive patterns by low-temperature sintering of micron silver ink-Reference-Cited by-同舟云学术

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Published:2023 Issue:13 Volume:13 Page:8636-8645
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Zhao Man¹,Tang Gongwen¹,Yang Shuai²,Fu Shancan²^ORCID

Affiliation:

1. The Institute of Seawater Desalination and Multipurpose Utilization, MNR (Tianjin), Tianjin, 300192, China

2. College of Engineering and Technology, Tianjin Agricultural University, Tianjin 300384, China

Abstract

The fabrication of dense conductive patterns was achieved by low-temperature sintering of 1–3 μm micron silver flakes with the help of the addition of a small amount of nanosilver particles.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/RA/D2RA07889A

Reference39 articles.

1. Flexible Electronics and Devices as Human‐Machine Interfaces for Medical Robotics

2. Fabrication of ballpoint-ink via encapsulating inorganic pigments in microemulsion gels

3. Facile preparation of stable reactive silver ink for highly conductive and flexible electrodes

4. Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

5. Enhancing ink adhesion of specialty paper using an interpenetrating polyvinyl alcohol-blocked polyurethane polymer network sizing system

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