High thermo-responsive shape memory epoxies based on substituted biphenyl mesogenic with good water resistance

Abstract

In this work, a novel epoxy monomer denoted as 3,5′-di-t-butyl-5,3′-dimethyl biphenyl diglycidyl ether was synthesized and applied intoin situcomposites with 3,3′,5,5′-tetramethyl-4,4′-biphenyl diglycidyl ether, accompanied with curing agent aromatic amines.