Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide-Reference-Cited by-同舟云学术

Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide

Author:

Wu Feng¹²³⁴⁵^ORCID,Zhou Xingping¹²³⁴⁵^ORCID,Yu Xinhai¹²³⁴⁵^ORCID

Affiliation:

1. College of Chemistry

2. Chemical Engineering and Biotechnology

3. Donghua University

4. Shanghai 201620

5. P. R. China

Abstract

The curing mechanism of the TGDDM/DICY system consisted of two main reactions and it experienced two autocatalytic curing processes.

Funder

Ministry of Education of the People's Republic of China

Science and Technology Commission of Shanghai Municipality

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

Reference52 articles.

1. C. A.May , Epoxy Resins Chemistry and Technology , Marcel Dekker, Inc. , 2nd edn, 1988

2. H. F.Mark , Encyclopedia of Polymer Science and Technology , Wiley & Sons, Inc. , 2004

3. E.Petrie , Epoxy adhesive formulations , McGraw Hill Professional , 2005

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