Solvent-free and photocurable polyimide inks for 3D printing
Author:
Affiliation:
1. State Key Laboratory of Solid Lubrication
2. Lanzhou Institute of Chemical Physics
3. Chinese Academy of Sciences
4. Lanzhou
5. China
6. Lanzhou Stomatology Hospital
Abstract
Solvent-free photosensitive high-performance polyimide inks were developed for DLP 3D printing to build architectures with excellent thermal resistance and mechanical performance.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2017/TA/C7TA01952A
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