Feasibility of using microencapsulated phase change materials as filler for improving low temperature performance of rubber sealing materials

Author:

Tiwari Avinash12345ORCID,Shubin Sergey N.678ORCID,Alcock Ben910115ORCID,Freidin Alexander B.678127ORCID,Thorkildsen Brede1314155,Echtermeyer Andreas T.12345ORCID

Affiliation:

1. Department of Mechanical and Industrial Engineering (MTP)

2. Norwegian University of Science and Technology (NTNU)

3. Richard Birkelands vei 2B

4. Trondheim

5. Norway

6. Institute for Problems in Mechanical Engineering of Russian Academy of Science

7. Saint-Petersburg

8. Russia

9. SINTEF Material and Chemistry

10. Department of Polymer and Composite Materials

11. Oslo

12. Peter the Great Saint-Petersburg Polytechnic University

13. TechnipFMC

14. P.O. Box 1012

15. 3601, Kongsberg

Abstract

The feasibility of microencapsulated phase change material (MEPCM) as filler in a rubber sealing material to improve sealing under transient cooling (in a so-called blowdown scenario) is investigated here.

Funder

Norges Forskningsråd

Publisher

Royal Society of Chemistry (RSC)

Subject

Condensed Matter Physics,General Chemistry

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