Curing temperature reduction and performance improvement of solution-processable hole-transporting materials for phosphorescent OLEDs by manipulation of cross-linking functionalities and core structures-Reference-Cited by-同舟云学术

Curing temperature reduction and performance improvement of solution-processable hole-transporting materials for phosphorescent OLEDs by manipulation of cross-linking functionalities and core structures

Published:2016 Issue:39 Volume:6 Page:33212-33220
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Ameen Shahid¹²³⁴⁵,Lee Jaemin¹²³⁴⁵,Han Hyun¹²³⁴,Suh Min Chul⁶⁷⁸⁴,Lee Changjin¹²³⁴⁵

Affiliation:

1. Advanced Materials Division

2. Korea Research Institute of Chemical Technology

3. Daejeon 305-600

4. Republic of Korea

5. University of Science & Technology (UST)

6. Department of Information Display

7. Kyung Hee University

8. Seoul 130-701

Abstract

Novel solution-processable hole-transporting materials for OLEDs capable of 150 °C thermal curing could be prepared by manipulation of cross-linking functionalities.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2016/RA/C6RA01966H

Reference32 articles.

1. Review of recent progress in multilayer solution-processed organic light-emitting diodes

2. Interface Engineering for Organic Electronics

3. Materials and Devices toward Fully Solution Processable Organic Light-Emitting Diodes

4. Crosslinkable TAPC-Based Hole-Transport Materials for Solution-Processed Organic Light-Emitting Diodes with Reduced Efficiency Roll-Off

5. Indolo[3,2-b]carbazole-based functional derivatives as materials for light emitting diodes

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