Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems-Reference-Cited by-同舟云学术

Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems

Published:2015 Issue:9 Volume:15 Page:1998-2001
ISSN:1473-0197
Container-title:Lab on a Chip
language:en
Short-container-title:Lab Chip

Author:

Kistrup K.¹²³⁴⁵^ORCID,Poulsen C. E.¹²³⁴⁵,Hansen M. F.¹²³⁴⁵,Wolff A.¹²³⁴⁵

Affiliation:

1. Department of Micro- and Nanotechnology

2. Technical University of Denmark

3. DTU Nanotech

4. DK-2800 Kongens Lyngby

5. Denmark

Abstract

We demonstrate ultrasonic welding for (1) self-aligned gapless bonding of a two-part lab-on-a-chip system and for (2) bonding of a large area shallow chamber. Combining injection moulding using micromilled shims with ultrasonic welding, we can go from design to a batch of chips within a single day. The chips are mass-producible with a total production time of 60 s per chip.

Publisher

Royal Society of Chemistry (RSC)

Subject

Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2015/LC/C5LC00174A

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