New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures-Reference-Cited by-同舟云学术

New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures

Published:2024 Issue:6 Volume:5 Page:2285-2295
ISSN:2633-5409
Container-title:Materials Advances
language:en
Short-container-title:Mater. Adv.

Author:

Castillo Ezer¹,Pasha Abdullah F.¹,Larson Zachary I.¹,Dimitrov Nikolay¹^ORCID

Affiliation:

1. Department of Chemistry, Binghamton University, SUNY P.O. Box 6000, Binghamton, New York, 13902, USA

Abstract

Two-step routine for the synthesis of nanoporous CuSn alloy material enabling joint formation in electronic packaging by sintering at 180 °C.

Funder

Semiconductor Research Corporation

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/MA/D3MA01071F

Reference44 articles.

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