Reduced coefficient of linear thermal expansion for colorless and transparent polyimide by introducing rigid-rod amide units: synthesis and properties-Reference-Cited by-同舟云学术

Reduced coefficient of linear thermal expansion for colorless and transparent polyimide by introducing rigid-rod amide units: synthesis and properties

Published:2022 Issue:20 Volume:13 Page:2999-3008
ISSN:1759-9954
Container-title:Polymer Chemistry
language:en
Short-container-title:Polym. Chem.

Author:

Zuo Hongtao¹,Qian Guangtao¹,Li Hai-Bei²^ORCID,Gan Feng³,Fang Yuting¹,Li Xiuting¹,Dong Jie¹,Zhao Xin¹^ORCID,Zhang Qinghua¹^ORCID

Affiliation:

1. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai 201620, P. R. China

2. School of Ocean, Shandong University, Weihai 264209, P. R. China

3. School of Textile Materials and Engineering, Wuyi University, Jiangmen, Guangdong 529020, P. R. China

Abstract

Polyimide films with high optical transparency and dimensional stability and low linear thermal expansion were synthesized by introducing rigid-rod amide units.

Funder

National Natural Science Foundation of China

Shanghai Municipal Education Commission

Basic and Applied Basic Research Foundation of Guangdong Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Organic Chemistry,Polymers and Plastics,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2022/PY/D2PY00062H

Reference34 articles.

1. Fabrication and characterization of a novel terpolyester film: An alternative substrate polymer for flexible electronic devices