Kinetics simulation and a novel curing procedure to avoid thermal shock during the curing process of epoxy composites-Reference-Cited by-同舟云学术

Kinetics simulation and a novel curing procedure to avoid thermal shock during the curing process of epoxy composites

Published:2016 Issue:70 Volume:6 Page:65533-65540
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Dong Hongxing¹²³⁴⁵,Li Yonghe¹²³⁴⁵,Zhang Jin¹²³⁴⁵,Liu Lijia¹²³⁴⁵,Cao Liying¹²³⁴⁵,Ming Pingjian⁶⁵⁷⁸,Liu Wenjing¹²³⁴⁵,Zhang Chunhong¹²³⁴⁵,Liu Lianhe¹²³⁴⁵,Wei Hao¹²³⁴⁵

Affiliation:

1. Institute of Advanced Marine Materials

2. Key Laboratory of Superlight Materials & Surface Technology

3. Ministry of Education

4. College of Materials Science and Chemical Engineering

5. Harbin Engineering University

6. College of Power and Energy Engineering

7. Harbin

8. China

Abstract

Thermal shock effects during curing process of an EP resin system was clear reduced by utilizing a novel curing procedure established according to the simulated results.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2016/RA/C6RA07448K

Reference28 articles.

1. Glycerol based tough hyperbranched epoxy: Synthesis, statistical optimization and property evaluation

2. Study of the Curing Kinetics of Epoxy Resins with Biobased Hardener and Epoxidized Soybean Oil

3. Effect of Conversion on the Structure−Property Relationships of Amine-Cured Epoxy Thermosets

4. Carbon nanotube/epoxy composites fabricated by resin transfer molding

5. Mechanical properties of multiwall carbon nanotubes/epoxy composites: influence of network morphology

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