Extremely flat metal films implemented by surface roughness transfer for flexible electronics-Reference-Cited by-同舟云学术

Extremely flat metal films implemented by surface roughness transfer for flexible electronics

Published:2018 Issue:20 Volume:8 Page:10883-10888
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Kim Kisoo¹²³⁴⁵^ORCID,Kim Sungjoo¹²³⁴⁵^ORCID,Jung Gwan Ho¹²³⁴⁵^ORCID,Lee Ilhwan¹²³⁴⁵^ORCID,Kim Sungjun¹²³⁴⁵^ORCID,Ham Juyoung¹²³⁴⁵^ORCID,Dong Wan Jae¹²³⁴⁵^ORCID,Hong Kihyon¹²³⁴⁵^ORCID,Lee Jong-Lam¹²³⁴⁵^ORCID

Affiliation:

1. Division of Advanced Materials Science

2. Department of Materials Science and Engineering

3. Pohang University of Science and Technology (POSTECH)

4. Pohang

5. Korea

Abstract

We present an innovative approach to fabricate an extremely flat (EF) metal film which was done by depositing metal on an extremely flat mother substrate, then detaching the metal from the substrate.

Funder

Ministry of Education, Science and Technology

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2018/RA/C8RA00298C

Reference34 articles.

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