Thermal management applied laminar composites with SiC nanowires enhanced interface bonding strength and thermal conductivity-Reference-Cited by-同舟云学术

Thermal management applied laminar composites with SiC nanowires enhanced interface bonding strength and thermal conductivity

Published:2019 Issue:34 Volume:11 Page:15836-15845
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Chang Jing¹²³⁴⁵^ORCID,Zhang Qiang¹²³⁴⁶,Lin Yingfei⁷⁸⁹,Shao Puzhen¹²³⁴,Pei Yinyin¹⁰¹¹¹²⁹,Zhong Sujuan¹⁰¹¹¹²⁹,Wu Gaohui¹²³⁴⁶

Affiliation:

1. School of Materials Science and Engineering

2. Harbin Institute of Technology

3. Harbin

4. P.R. China

5. School of Physical and Mathematical Sciences

6. Key Laboratory of Advanced Structure-Function Integrated Materials and Green Manufacturing Technology

7. Guangdong Institute of Materials and Processing

8. Guangzhou

9. P. R. China

10. State Key Laboratory of Advanced Brazing Filler Materials & Technology

11. Zhengzhou Research Institute of Mechanical Engineering Co. Ltd.

12. Zhengzhou

Abstract

Thermal management applied laminar composites with enhanced interface bonding strength and thermal conductivity were fabricated through a pressure infiltration method.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Guangdong Academy of Sciences

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2019/NR/C9NR04644E

Reference52 articles.

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4. Largely enhanced thermal conductivity of graphene/copper composites with highly aligned graphene network

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