Flexible copper wires through galvanic replacement of zinc paste: a highly cost-effective technology for wiring flexible printed circuits-Reference-Cited by-同舟云学术

Flexible copper wires through galvanic replacement of zinc paste: a highly cost-effective technology for wiring flexible printed circuits

Published:2015 Issue:32 Volume:3 Page:8329-8335
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Liu Jingping¹²³⁴⁵,Yang Cheng¹²³⁴⁵,Zou Peichao¹²³⁴⁵,Yang Rui¹²³⁴⁵,Xu Chao¹²³⁴⁵,Xie Binghe¹²³⁴⁵,Lin Ziyin⁶⁷⁸⁹,Kang Feiyu¹²³⁴⁵,Wong Ching Ping⁶⁷⁸⁹¹⁰

Affiliation:

1. Division of Energy and Environment

2. Graduate School at Shenzhen

3. Tsinghua University

4. Shenzhen 518055

5. P. R. China

6. School of Materials Science and Engineering

7. Georgia Institute of Technology

8. Atlanta

9. USA

10. Department of Electronic Engineering

Abstract

This work demonstrates a galvanic replacement reaction based route to fabricate highly conductive flexible Cu circuits. The Zn/epoxy paste serves as a seed layer and interconnects the electroplated Cu layer to the substrate.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/TC/C5TC01421B

Reference47 articles.

1. Materials for Bioresorbable Radio Frequency Electronics

2. Rational Design of a Printable, Highly Conductive Silicone-based Electrically Conductive Adhesive for Stretchable Radio-Frequency Antennas

3. High-Performance Biodegradable/Transient Electronics on Biodegradable Polymers

4. Ultrathin conformal devices for precise and continuous thermal characterization of human skin

5. Multifunctional Epidermal Electronics Printed Directly Onto the Skin

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