Electroforming of a metal–organic framework on porous copper hollow fibers
Author:
Affiliation:
1. Membrane Science and Technology Cluster
2. Faculty of Science and Technology
3. MESA+ Institute for Nanotechnology
4. University of Twente
5. Enschede
Abstract
Porous hollow fibers are used for the first time as both support and metal source for electroforming of MOF films.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2019/TA/C8TA11296G
Reference66 articles.
1. Ultrahigh Porosity in Metal-Organic Frameworks
2. The Chemistry and Applications of Metal-Organic Frameworks
3. Design and synthesis of an exceptionally stable and highly porous metal-organic framework
4. Flexibility in Metal–Organic Frameworks: A fundamental understanding
5. Tuning the Topology and Functionality of Metal−Organic Frameworks by Ligand Design
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