Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM1+xSn1−xS4 (M = Ti, V, Cr, Co)]

Author:

Bourgès Cédric12345,Srinivasan Bhuvanesh12346ORCID,Fontaine Bruno7891011,Sauerschnig Philipp1234,Minard Alizée6121323,Halet Jean-François6121323ORCID,Miyazaki Yuzuru51415164,Berthebaud David6121323ORCID,Mori Takao123417ORCID

Affiliation:

1. WPI International Center for Materials Nanoarchitechtonics (WPI-MANA)

2. National Institute for Materials Science (NIMS)

3. Tsukuba

4. Japan

5. Department of Applied Physics

6. CNRS-Saint Gobain-NIMS

7. Univ. Rennes

8. Ecole Nationale Supérieure de Chimie de Rennes

9. CNRS

10. ISCR – UMR 6226

11. F-35000 Rennes

12. UMI 3629

13. Laboratory for Innovative Key Materials and Structures (LINK)

14. Graduate School of Engineering

15. Tohoku University

16. Sendai

17. Graduate School of Pure and Applied Sciences

Abstract

The thermoelectric properties of a series of Cu–Sn based thiospinel compounds by screening a variety of transition elements (M = Ti, V, Cr, Co) as a potential substituent at the Sn-site (both p- and n-type thiospionels) are reported and discussed.

Funder

Japan Society for the Promotion of Science

Japan Science and Technology Agency

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

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