Inherent mechanical properties of bilayer germanene coupled by covalent bonding
Author:
Affiliation:
1. Department of Mechanical Engineering
2. Bangladesh University of Engineering and Technology
3. Dhaka-1205
4. Bangladesh
Abstract
Presence of interlayer bonds in bi-layer germanene results in a distinct fracture mechanism in tensile loading and direction dependent periodic behavior in shear loading.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2019/RA/C9RA06003K
Reference60 articles.
1. Mechanically Strong, Electrically Conductive, and Biocompatible Graphene Paper
2. The rise of graphene
3. Measurement of the Elastic Properties and Intrinsic Strength of Monolayer Graphene
4. Enhanced Mechanical Properties of Graphene-Based Poly(vinyl alcohol) Composites
5. Evolution of Electrical, Chemical, and Structural Properties of Transparent and Conducting Chemically Derived Graphene Thin Films
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