Surface adhesion engineering for robust organic semiconductor devices-Reference-Cited by-同舟云学术

Surface adhesion engineering for robust organic semiconductor devices

Published:2022 Issue:7 Volume:10 Page:2516-2526
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Wang Zhao¹²,Wang Wenbo¹²,Wang Shutao¹²^ORCID

Affiliation:

1. Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

2. School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China

Abstract

Strategies for enhancing interfacial adhesion of organic semiconductors by adhesive layer introduction, adhesive group functionalization, adhesive integrated agent, and physical mixing, have shown promising applications in various fields.

Funder

National Natural Science Foundation of China

Chinese Academy of Sciences

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/TC/D1TC05966A

Reference113 articles.

1. n-Type Organic Semiconductors in Organic Electronics

2. Organic semiconductor crystals

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4. Organic semiconductor crystals

5. Organic Semiconductors at the University of Washington: Advancements in Materials Design and Synthesis and toward Industrial Scale Production

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