Adhesion performance study of a novel microstructured stamp for micro-transfer printing-Reference-Cited by-同舟云学术

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Adhesion performance study of a novel microstructured stamp for micro-transfer printing

Published:2021 Issue:19 Volume:17 Page:4989-4997
ISSN:1744-683X
Container-title:Soft Matter
language:en
Short-container-title:Soft Matter

Author:

Liang Cunman¹²³⁴⁵^ORCID,Wang Fujun¹²³⁴⁵,Huo Zhichen¹²³⁴⁵,Shi Beichao¹²³⁴⁵,Tian Yanling¹²³⁴⁵,Zhang Dawei¹²³⁴⁵

Affiliation:

1. Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education

2. School of Mechanical Engineering

3. Tianjin University

4. Tianjin 300350

5. China

Abstract

We propose a novel microstructured stamp for micro-transfer printing, which consists of a microchamber and microchannels.

Funder

National Natural Science Foundation of China

Tianjin Science and Technology Committee

National Science and Technology Infrastructure Program

Horizon 2020 Framework Programme

Publisher

Royal Society of Chemistry (RSC)

Subject

Condensed Matter Physics,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2021/SM/D0SM02161J

Reference37 articles.

1. Skin electronics from scalable fabrication of an intrinsically stretchable transistor array

2. Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery

3. Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants

4. Recent advances of conductive nanocomposites in printed and flexible electronics

5. Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

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1. Mechanics, structure, and materials science of transfer printing;Transfer Printing Technologies and Applications;2024

2. Printing of Nano‐ to Chip‐Scale Structures for Flexible Hybrid Electronics;Advanced Electronic Materials;2022-12-23

3. The Adhesive Force Measurement between Single μLED and Substrate Based on Atomic Force Microscope;Applied Sciences;2022-09-21

4. Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing;Micromachines;2021-11-03

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