Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures-Reference-Cited by-同舟云学术

Characterization of waste printed circuit boards recycled using a dissolution approach and ultrasonic treatment at low temperatures

Published:2017 Issue:60 Volume:7 Page:37729-37738
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Tatariants Maksym¹²³⁴⁵^ORCID,Yousef Samy⁶⁷³⁸⁵,Sidaraviciute Ruta¹²³⁴⁵,Denafas Gintaras¹²³⁴⁵,Bendikiene Regita⁶⁷³⁸⁵

Affiliation:

1. Department of Environmental Technology

2. Faculty of Chemical Technology

3. Kaunas University of Technology

4. LT-50254 Kaunas

5. Lithuania

6. Department of Production Engineering

7. Faculty of Mechanical Engineering and Design

8. LT-51424 Kaunas

Abstract

All the WPCB samples had similar structure, which comprises six layers of fiberglass (representing WPCB substrate), two copper foil layers (upper and lower layers), copper tracks, through-hole pads and two soldermask layers (upper and lower layers).

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/RA/C7RA07034A

Reference37 articles.

1. Precious metals recovery from waste printed circuit boards: A review for current status and perspective

2. Recycling of non-metallic fractions from waste printed circuit boards: A review

3. Recycling of waste printed circuit boards: A review of current technologies and treatment status in China

4. Recycling and Disposal Technology for Non-mentallic Materials from Waste Printed Circuit Boards(WPCBs) in China

5. E-waste recycling processes in Indonesia, the Philippines, and Vietnam: A case study of cathode ray tube TVs and monitors

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