Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials-Reference-Cited by-同舟云学术

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials

Published:2015 Issue:40 Volume:3 Page:10590-10596
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Li C. C.¹²³⁴¹,Drymiotis F.⁵⁶⁷⁴,Liao L. L.⁸⁹¹⁰¹¹,Hung H. T.¹¹²¹³¹¹,Ke J. H.¹⁴¹⁵¹⁶⁴,Liu C. K.⁸⁹¹⁰¹¹,Kao C. R.¹¹²¹³¹¹,Snyder G. J.¹²³⁴

Affiliation:

1. Department of Materials Science and Engineering

2. Northwestern University

3. Evanston

4. USA

5. Department of Applied Physics and Materials Science

6. California Institute of Technology

7. Pasadena

8. Electronic and Optoelectronics Research Laboratories

9. Industrial Technology Research Institute

10. Hsinchu

11. Taiwan

12. National Taiwan University

13. Taipei

14. Materials Science and Engineering

15. University of Wisconsin-Madison

16. Madison

Abstract

The development of reliable bonding materials for PbTe-based thermoelectric modules that can undergo long-term operations at high temperature is carried out.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/TC/C5TC01662B

Reference39 articles.

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