The record low thermal conductivity of monolayer cuprous iodide (CuI) with a direct wide bandgap-Reference-Cited by-同舟云学术

The record low thermal conductivity of monolayer cuprous iodide (CuI) with a direct wide bandgap

Published:2022 Issue:46 Volume:14 Page:17401-17408
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Xu Jinyuan¹^ORCID,Chen Ailing¹^ORCID,Yu Linfeng¹^ORCID,Wei Donghai¹^ORCID,Tian Qikun²^ORCID,Wang Huimin³^ORCID,Qin Zhenzhen²^ORCID,Qin Guangzhao¹^ORCID

Affiliation:

1. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, P. R. China

2. International Laboratory for Quantum Functional Materials of Henan, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou 450001, P. R. China

3. Hunan Key Laboratory for Micro-Nano Energy Materials & Device and School of Physics and Optoelectronics, Xiangtan University, Xiangtan 411105, Hunan, P. R. China

Abstract

The ultralow thermal conductivity (0.116 W m−1 K−1) and direct wide bandgap (3.57 eV) of monolayer CuI promise its potential applications in transparent and wearable electronics.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2022/NR/D2NR04408K

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